Materials usually involve a trade-off: stiff materials tend to conduct heat well, while soft ones, such as silicone, insulate it effectively. Researchers at the University of North Carolina have managed to combine both properties in a single thin film.
Its thermal conductivity is five times lower than that of standard silicone, while its stiffness is 700 to 10,000 times greater. The secret lies in a distinctive molecular structure that makes it harder for thermal vibrations to pass through.
The material could find applications in electronics and space technology, where it is especially important to protect equipment from overheating without increasing the mass or size of structures.
